Phase Change Materials
PTM7900
PTM7900 is a Phase Change Pad with a Thermal Impedance of 0.04 - 0.08 (OC cm²/w), Thermal Conductivity of 8 (w/mk) and Specific Gravity of 2.8 (g/cm³)
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PTM7900 has a Thermal conductivity of 8.0 (W/m·K) depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. This proprietary material provides superior reliability and maintains low thermal impedance (0.04 - 0.08 OC cm2/w), making it desirable for high-performance integrated circuit devices. It has been qualified by major GPU and cooling solution manufacturers across the globe.
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Color
- Grey
- Specific Gravity
- 2.8 g/cm3, Test Method ASTM D374
- Thickness (mm)
- 0.2 / 0.25 / 0.3 / 0.4 / 0.5
- Viscosity
- N/A
- Liner Color
- Light Blue
- Format
- Pad
Thermal Properties
- Thermal Conductivity
- 8.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.04-0.08 at no shim °C cm²/w, Test Method ASTM D5470 Modified
General Information
- Application
- Base Station
- CPU
- GPU
- Laser
- Memory
- Optical
- Switch
- Tranceiver
- Vertical
- Consumer Electronics
- Telecom/Data Center
- Sub-segment
- Networks
- Notebook/Tablet/PC
- Projector
- Server
- Industry
- Auto Electronics/EV
- Consumer electronics
- Telecom/Data Center
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Color
- Grey
- Specific Gravity
- 2.8 g/cm3, Test Method ASTM D374
- Thickness (mm)
- 0.2 / 0.25 / 0.3 / 0.4 / 0.5
- Viscosity
- N/A
- Liner Color
- Light Blue
- Format
- Pad
Thermal Properties
- Thermal Conductivity
- 8.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.04-0.08 at no shim °C cm²/w, Test Method ASTM D5470 Modified
General Information
- Application
- Base Station
- CPU
- GPU
- Laser
- Memory
- Optical
- Switch
- Tranceiver
- Vertical
- Consumer Electronics
- Telecom/Data Center
- Sub-segment
- Networks
- Notebook/Tablet/PC
- Projector
- Server
- Industry
- Auto Electronics/EV
- Consumer electronics
- Telecom/Data Center
- Viscosity : N/A
- Thickness (mm) : 0.2 / 0.25 / 0.3 / 0.4 / 0.5
- Thermal Impedance : 0.04-0.08 at no shim °C cm²/w, Test Method ASTM D5470 Modified
- Thermal Conductivity : 8.0 W/m-K, Test Method ASTM D5470
- Specific Gravity : 2.8 g/cm3, Test Method ASTM D374
- Liner Color : Light Blue
- Format : Pad
- Color : Grey
- Bond-Line Thickness (BLT) : 0.038
- Application : Base Station|CPU|GPU|Laser|Memory|Optical|Switch|Tranceiver
- Vertical : Consumer Electronics|Telecom/Data Center
- Sub-segment : Networks|Notebook/Tablet/PC|Projector|Server
- Industry : Auto Electronics/EV|Consumer electronics|Telecom/Data Center