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Patterning Assistance Materials
Honeywell DUO™ 248
A silicon-rich BARC for damascene and other advanced patterning applications
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Overview
DUO248 is designed for use in semiconductor manufacturing to improve and extend KrF photolithography and the plasma etch process. Containing a patented* organo-siloxane (RxCH3ySiOz) polymer (R = organic chromophore), DUO248 coatings meet the lithographic and etch requirements necessary for the patterning of thin film features within state-of-the-art IC devices. Properties include: bottom anti-reflective coating (BARC) for ArF lithography, and fill planarization of line or via topograph.DUO248 offers excellent plasma etch characteristics. The organo-siloxane polymer comprising DUO248 provides a high degree of plasma etch selectivity to photoresist. Additionally, the organo-siloxane polymer allows for matched plasma etch selectivity to Low-k SiOCH and FSG dielectric films facilitating Dual Damascene patterning. Such plasma etch selectivity is required for exact transfer of the as patterned photoresist dimensions into the underlying thin films.DUO248 is selectively removed using appropriate photoresist strip and wet etch chemistries.
Specifications
General Information
- Application
- Anti-Reflective Coating (ARC)
- BARC
- Gap Fill
- Planarization
- Semiconductor Manufacturing
- Brand
- Honeywell
General Information
- Application
- Anti-Reflective Coating (ARC)
- BARC
- Gap Fill
- Planarization
- Semiconductor Manufacturing
- Brand
- Honeywell
- Brand : Honeywell
- Application : Anti-Reflective Coating (ARC)|BARC|Gap Fill|Planarization|Semiconductor Manufacturing
Sell Sheet
Name
Description
File Size
Date
Size
Silicon-rich barc for single and dual damascene, and other advanced patterning applications
application/pdf 587.79 KB
10/31/2023
587.79 KB
Name
Description
File Size
Date
Size
Silicon-rich barc for single and dual damascene, and other advanced patterning applications
application/pdf 587.79 KB
10/31/2023
587.79 KB
Name
Description
File Size
Date
Size
Silicon-rich barc for single and dual damascene, and other advanced patterning applications
587.79 KB
10/31/2023
