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Thermal Putty Pads
TGP8000PT
Honeywell Thermally Conductive Putty Pads TGPXXXXPT series enables excellent gap-filling capability for applications with large dimensional variances. (8.0 W/m·K, ultra soft pad)
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Overview
Honeywell Thermally Conductive Putty Pads provide high thermal performance and solid thermal reliability. The material’s putty-like consistency enables excellent gap-filling capability for applications with large dimensional variances. Special surface reinforcement enables easier handling for operators, with no pull-out during high-volume assembly. The product is naturally tacky and requires no additional adhesive to mate to the heat source and heat sink.Typical Applications• EV battery & charging station• Automotive electronics• Power devices & modules• Telecommunications & network serversFeatures• High thermal performance• Ultra-soft• High compressibility• Excellent gap-filling capability• Naturally tacky
Specifications
Physical Properties
- Color
- Grey
- Hardness
- 5 Shore00, Test Method ASTM D2240
- Specific Gravity
- 3.5, Test Method ASTM D792
- Thickness (mm)
- 0.5-5, Test Method ASTM D374
Thermal Properties
- Thermal Conductivity
- 8.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.19 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
Electrical Properties
- Dielectric Constant
- 8.5 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 4.0x10<sup>15</sup> ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
General Information
- Application
- EV battery & charging station
- Power devices & modules
- Telecommunications & network servers
- Key Features
- Extra Soft
- Typical Uses
- EV battery & charging station
- Power devices & modules
- Telecommunications & network servers
Physical Properties
- Color
- Grey
- Hardness
- 5 Shore00, Test Method ASTM D2240
- Specific Gravity
- 3.5, Test Method ASTM D792
- Thickness (mm)
- 0.5-5, Test Method ASTM D374
Thermal Properties
- Thermal Conductivity
- 8.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.19 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
Electrical Properties
- Dielectric Constant
- 8.5 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 4.0x10<sup>15</sup> ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
General Information
- Application
- EV battery & charging station
- Power devices & modules
- Telecommunications & network servers
- Key Features
- Extra Soft
- Typical Uses
- EV battery & charging station
- Power devices & modules
- Telecommunications & network servers
- Specific Gravity : 3.5, Test Method ASTM D792
- Thermal Impedance : 0.19 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
- Thermal Conductivity : 8.0 W/m-K, Test Method ASTM D5470
- Color : Grey
- Thickness (mm) : 0.5-5, Test Method ASTM D374
- Hardness : 5 Shore00, Test Method ASTM D2240
- Volume Resistivity : 4.0x1015 ohm-cm, Test Method ASTM D257
- Flammability : V-0, Test Method UL94
- Dielectric Constant : 8.5 at 1MHz, Test Method ASTM D150
- Typical Uses : EV battery & charging station|Power devices & modules|Telecommunications & network servers
- Application : EV battery & charging station|Power devices & modules|Telecommunications & network servers
- Key Features : Extra Soft
Others
Name
Description
File Size
Date
Size
Thermal Putty Pads: TGP3500PT - 8000PT
application/pdf 113.1 KB
10/31/2023
113.1 KB
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Name
Description
File Size
Date
Size
Thermal Putty Pads: TGP3500PT - 8000PT
application/pdf 113.1 KB
10/31/2023
113.1 KB
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
820.98 KB
10/31/2023
