false
false
false
Thermal Two-Part Hybrids
HLT10000
Honeywell HLT series products are two-component cured-in-place dispensable gap fillers could be easily dispensed w/good thixotropic characteristics and low viscosity, provides the high compressibility and excellent long term reliability. (10.0 W/m·K)
Please sign in to access more documents
Once signed in, you may be able to access additional documents for your account.
Overview
Two-Part, Dispensable, Very Low Compression Force HLT series products are two-component, dispensable thermally conductive gels, which offer long-term reliability and superior softness. The enhanced bonding force between the polymer base and the filler minimizes oil separation issues in storage. Prior to curing, the material maintains good thixotropic characteristics and low viscosity to be easily dispensed.Typical Applications• Consumer electronics• Telecommunications equipment• Automotive electronics• Memory & power modulesFeatures• Low contact resistance• Easily to dispense and rework• High compressibility for low stress applications• Long-term reliability• Reduced oil separation• No pump-out and cracking
Specifications
Physical Properties
- Color
- N/A
- Cure Schedule
- N/A
- Shelf Life
- 6 months Year
- Specific Gravity
- N/A
- Viscosity
- N/A
Thermal Properties
- Thermal Conductivity
- 10.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- N/A
General Information
- Application
- Automation Gap Filler
- Key Features
- High compressibility for low stress applications
- Long-term reliability
- Low contact resistance
- No pump-out and cracking
- Reduced oil separation
- Typical Uses
- Consumer electronics
- Memory & power modules
- Telecommunications equipment
Physical Properties
- Color
- N/A
- Cure Schedule
- N/A
- Shelf Life
- 6 months Year
- Specific Gravity
- N/A
- Viscosity
- N/A
Thermal Properties
- Thermal Conductivity
- 10.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- N/A
General Information
- Application
- Automation Gap Filler
- Key Features
- High compressibility for low stress applications
- Long-term reliability
- Low contact resistance
- No pump-out and cracking
- Reduced oil separation
- Typical Uses
- Consumer electronics
- Memory & power modules
- Telecommunications equipment
- Color : N/A
- Specific Gravity : N/A
- Thermal Impedance : N/A
- Cure Schedule : N/A
- Thermal Conductivity : 10.0 W/m-K, Test Method ASTM D5470
- Shelf Life : 6 months Year
- Viscosity : N/A
- Key Features : High compressibility for low stress applications|Long-term reliability|Low contact resistance|No pump-out and cracking|Reduced oil separation
- Typical Uses : Consumer electronics|Memory & power modules|Telecommunications equipment
- Application : Automation Gap Filler
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
820.98 KB
10/31/2023
