The Thermal Two-Part Hybrids products are two-component, dispensable thermally conductive gels that offer long-term reliability and superior softness. The enhanced bonding force between the polymer base and the filler minimizes oil separation issues in storage.

Thermal hybrid gels require very low compression force and can be used for vertical mounting. Before curing, the materials maintain good thixotropic characteristics and low viscosity to be easily dispensed. Additionally, they show minimal post-cure oil bleeding/separation and no pump-out or cracking.

Two component hybrid thermal gels can be cured in a short time after two-component mixing at room temperature. HLT series thermal gels require curing but very little pressure during installation (5-10psi or the weight of a heatsink is sufficient). You can speed up the process by curing at elevated temperatures (80 -100°C).  The high compressibility minimizes thermal resistance at interfaces, making hybrids ideal for low stress applications while maintaining excellent performance during reliability testing.

Featured product: 

HLT10000 High TC Hybrid Thermal Interface Material (TIM) has a thermal conductivity of 10 W/mK, high reliability, and ease of dispensing. It can be cured after two-component mixing and faster under higher temperatures. Its high compressibility minimizes interface thermal resistance while maintaining excellent performance during reliability testing.

This product is engineered for the most demanding and delicate applications on the market. It starts with a very low thickness and compresses just as easily, reaching its final thickness at a remarkable rate. It is also easy to dispense and rework, making it ideal for high volume manufacturing. To add to that, it offers reduced oil separation and doesn't exhibit pump out or cracking.

Honeywell Thermal Gap Pads are designed for thick bond line applications with large variances in gap dimensions between heat sources and heat sinks. Where the heat source is comprised of multiple microprocessors soldered onto a printed circuit board, the gap filler pads need to fill spaces between the chips and the heat sink. In the consumer electronics industry, Thermal Gap Pads must be simultaneously soft, elastic and thermally conductive. For manufacturers operating at the current technological level, a balance must be struck between high rebound resilience and low hardness. Honeywell Thermal Gap Pads provide exceptional thermal conductivity, exert limited pressure onto the chip and PCB to avoid damage, and ensure the rebound necessary to enable sustainable surface contact – all while minimizing outgassing and oil bleeding to maintain long-term device reliability.

Featured Products

Honeywell HGP10000 thermal gap pad provides high thermal performance with ease of use across multitude of applications. Its ultra-high compressibility enables low stress and excellent conformity to mating surfaces. It is designed to minimize thermal resistance at interfaces and maintain excellent performance through reliability testing.

Key features

• 10 W/m·K thermal conductivity
• Ultra-high compressibility for low stress applications
• High residual stress after relaxation
• Excellent surface wetting for low contact resistance
• High reliability
• Electrically insulating
• Available in thickness range from 1mm to 5.0mm with 0.25mm incremental

HGP14 High Thermal Conductivity Gap Pad

HGP14 is a high-performance thermal interface material designed for efficient heat transfer in demanding electronic applications. It offers a thermal conductivity of 14.0 W/m·K, making it well-suited for systems requiring high thermal dissipation across varying bond line thicknesses. The material is soft and conformable, allowing it to fill gaps between components and heat sinks without introducing significant mechanical stress. This makes it suitable for use with fragile components or assemblies where minimizing stress during installation is critical.

HGP14 also maintains material integrity over time, with low volatility and minimal oil bleed, reducing the risk of contamination or pump-out under thermal cycling. Its stability makes it a strong choice for applications sensitive to oil migration or where long-term performance is required. Honeywell HGP14 is well-suited for high-power electronics, automotive systems, and telecommunications equipment, where superior heat dissipation and long-term stability are essential.