Phase Change Materials
PTM5000-SP
PTM5000-SP is a Phase Change Paste with a Thermal Impedance of 0.06 – 0.08 (OC cm²/w), Thermal Conductivity of 4.4 (w/mk) and Specific Gravity of 2.3 (g/cm³)
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PTM5000-SP has a Thermal conductivity of 4.4 (W/m·K) depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The proprietary material provides superior reliability and maintains low thermal impedance (0.06-0.08), making it desirable for high-performance integrated circuit devices.
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Specific Gravity
- 2 g/cm3, Test Method ASTM D374
- Viscosity
- 82
- Format
- Paste/Printable
- Drying Type
- Fast
Thermal Properties
- Thermal Conductivity
- 4.4 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.06-0.08 at no shim °C cm²/w, Test Method ASTM D5470 Modified
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Specific Gravity
- 2 g/cm3, Test Method ASTM D374
- Viscosity
- 82
- Format
- Paste/Printable
- Drying Type
- Fast
Thermal Properties
- Thermal Conductivity
- 4.4 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.06-0.08 at no shim °C cm²/w, Test Method ASTM D5470 Modified
- Format : Paste/Printable
- Bond-Line Thickness (BLT) : 0.038
- Thermal Conductivity : 4.4 W/m-K, Test Method ASTM D5470
- Thermal Impedance : 0.06-0.08 at no shim °C cm²/w, Test Method ASTM D5470 Modified
- Specific Gravity : 2 g/cm3, Test Method ASTM D374
- Drying Type : Fast
- Viscosity : 82