Phase Change Materials
PTM7000-SP
PTM7000-SP is a viscous, stencil printable paste version of PTM7000, with Thermal Impedance of 0.04 - 0.07 (OC cm²/w), Thermal Conductivity of 6.5 (w/mk) and Specific Gravity of 2.3 (g/cm³)
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PTM7000-SP has a thermal conductivity of 6.5 (W/m·K), depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The usual temperature range is -40°C to 125°C. This proprietary material provides superior reliability and maintains low thermal impedance (0.04 – 0.07), making it desirable for high-performance integrated circuit devices. Regarding breakdown voltage, phase change materials are typically around 5000V/mm, which is highly thickness-dependent. An initial "unphased" 0.2mm pad will have a different BV than the final 30/40um bondline.
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Specific Gravity
- 2.3 g/cm3, Test Method ASTM D374
- Viscosity
- 120
- Format
- Paste/Printable
- Drying Type
- Fast
Thermal Properties
- Thermal Conductivity
- 6.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.04-0.07 at no shim °C cm²/w, Test Method ASTM D5470 Modified
General Information
- Application
- High Reliability
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Specific Gravity
- 2.3 g/cm3, Test Method ASTM D374
- Viscosity
- 120
- Format
- Paste/Printable
- Drying Type
- Fast
Thermal Properties
- Thermal Conductivity
- 6.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.04-0.07 at no shim °C cm²/w, Test Method ASTM D5470 Modified
General Information
- Application
- High Reliability
- Format : Paste/Printable
- Bond-Line Thickness (BLT) : 0.038
- Thermal Conductivity : 6.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance : 0.04-0.07 at no shim °C cm²/w, Test Method ASTM D5470 Modified
- Specific Gravity : 2.3 g/cm3, Test Method ASTM D374
- Drying Type : Fast
- Viscosity : 120
- Application : High Reliability