Phase Change Materials
PTM7000-SP
PTM7000-SP is a viscous, stencil printable paste version of PTM7000, with Thermal Impedance of 0.04 - 0.07 (°C cm²/w), Thermal Conductivity of 6.5 (w/mk) and Specific Gravity of 2.3 (g/cm³)
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Overview
PTM7000-SP is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing, which is required for long product life applications. Like all phase change materials, it has stable thermal impedance across accelerated aging tests and does not display bleeding, pumping, or flow out.
PTM7000-SP has a thermal conductivity of 6.5 (W/m·K), depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The usual temperature range is -40°C to 125°C. This proprietary material provides superior reliability and maintains low thermal impedance (0.04 – 0.07), making it desirable for high-performance integrated circuit devices. Regarding breakdown voltage, phase change materials are typically around 5000V/mm, which is highly thickness-dependent. An initial "unphased" 0.2mm pad will have a different BV than the final 30/40um bondline.
PTM7000-SP has a thermal conductivity of 6.5 (W/m·K), depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The usual temperature range is -40°C to 125°C. This proprietary material provides superior reliability and maintains low thermal impedance (0.04 – 0.07), making it desirable for high-performance integrated circuit devices. Regarding breakdown voltage, phase change materials are typically around 5000V/mm, which is highly thickness-dependent. An initial "unphased" 0.2mm pad will have a different BV than the final 30/40um bondline.
Specifications
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Color
- Grey
- Shelf Life
- 12 months Year
- Specific Gravity
- 2.3 g/cm3, Test Method ASTM D374
- Viscosity
- 120
- Liner Color
- N/A
- Format
- Paste
- Stencil Printable
- Drying Type
- Fast
Thermal Properties
- Thermal Conductivity
- 6.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.04-0.07 at no shim °C cm²/w, Test Method ASTM D5470 Modified
General Information
- Application
- CPU
- GPU
- Memory
- Power Device
- Thin Bondline
- Key Features
- High Reliability
- Low TI
- Sub-segment
- ADAS
- Notebook
- PC
- Tablet
- Industry
- Automotive
- Consumer Electronics
Other
- Other Notes
- Stencil printable (SP) available in 300cc syringes or 1kg jars
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Color
- Grey
- Shelf Life
- 12 months Year
- Specific Gravity
- 2.3 g/cm3, Test Method ASTM D374
- Viscosity
- 120
- Liner Color
- N/A
- Format
- Paste
- Stencil Printable
- Drying Type
- Fast
Thermal Properties
- Thermal Conductivity
- 6.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.04-0.07 at no shim °C cm²/w, Test Method ASTM D5470 Modified
General Information
- Application
- CPU
- GPU
- Memory
- Power Device
- Thin Bondline
- Key Features
- High Reliability
- Low TI
- Sub-segment
- ADAS
- Notebook
- PC
- Tablet
- Industry
- Automotive
- Consumer Electronics
Other
- Other Notes
- Stencil printable (SP) available in 300cc syringes or 1kg jars
- Viscosity : 120
- Thermal Impedance : 0.04-0.07 at no shim °C cm²/w, Test Method ASTM D5470 Modified
- Thermal Conductivity : 6.5 W/m-K, Test Method ASTM D5470
- Specific Gravity : 2.3 g/cm3, Test Method ASTM D374
- Shelf Life : 12 months Year
- Liner Color : N/A
- Format : Paste|Stencil Printable
- Drying Type : Fast
- Color : Grey
- Bond-Line Thickness (BLT) : 0.038
- Application : CPU|GPU|Memory|Power Device|Thin Bondline
- Sub-segment : ADAS|Notebook|PC|Tablet
- Key Features : High Reliability|Low TI
- Industry : Automotive|Consumer Electronics
- Other Notes : Stencil printable (SP) available in 300cc syringes or 1kg jars
Application Note
Name
Description
File Size
Date
Size
In Modern Electronic Devices
application/pdf 316.14 KB
8/11/2025
316.14 KB
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
application/pdf 900.68 KB
8/7/2025
900.68 KB
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
Case Study
Name
Description
File Size
Date
Size
For New Energy Vehicle Inverters
application/pdf 3.31 MB
6/12/2025
3.31 MB
Name
Description
File Size
Date
Size
In Modern Electronic Devices
application/pdf 316.14 KB
8/11/2025
316.14 KB
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
For New Energy Vehicle Inverters
application/pdf 3.31 MB
6/12/2025
3.31 MB
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
application/pdf 900.68 KB
8/7/2025
900.68 KB
Name
Description
File Size
Date
Size
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
900.68 KB
8/7/2025
Thermal Interface Materials Electronics Brochure
821.77 KB
8/7/2025
For New Energy Vehicle Inverters
3.31 MB
6/12/2025