Phase Change Materials
PTM7900-SP
PTM7900-SP is a Phase Change Paste with a Thermal Impedance of 0.04 - 0.08 (OC cm²/w), Thermal Conductivity of 8 (w/mk) and Specific Gravity of 2.5 (g/cm³). Its drying time is 24 hours at room temperature and under 5 minutes at 100oC
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Overview
PTM7900-SP is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing for long product life applications. It has stable thermal impedance across accelerated aging tests and does not display bleeding, pumping, or flow out.
PTM7900 has a Thermal conductivity of 8.0 (W/m·K) depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. This proprietary material provides superior reliability and maintains low thermal impedance (0.04 - 0.08 OC cm2/w), making it desirable for high-performance integrated circuit devices. It has been qualified by major GPU and cooling solution manufacturers across the globe.
PTM7900 has a Thermal conductivity of 8.0 (W/m·K) depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. This proprietary material provides superior reliability and maintains low thermal impedance (0.04 - 0.08 OC cm2/w), making it desirable for high-performance integrated circuit devices. It has been qualified by major GPU and cooling solution manufacturers across the globe.
Specifications
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Specific Gravity
- 2.5 g/cm3, Test Method ASTM D374
- Viscosity
- 177
- Format
- Paste/Printable
- Drying Type
- Fast
Thermal Properties
- Thermal Conductivity
- 8.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.04-0.08 at no shim °C cm²/w, Test Method ASTM D5470 Modified
General Information
- Application
- CPU
- GPU
- Sub-segment
- Notebook/Tablet/PC
- Vertical
- Consumer Electronics
- Industry
- Consumer electronics
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Specific Gravity
- 2.5 g/cm3, Test Method ASTM D374
- Viscosity
- 177
- Format
- Paste/Printable
- Drying Type
- Fast
Thermal Properties
- Thermal Conductivity
- 8.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.04-0.08 at no shim °C cm²/w, Test Method ASTM D5470 Modified
General Information
- Application
- CPU
- GPU
- Sub-segment
- Notebook/Tablet/PC
- Vertical
- Consumer Electronics
- Industry
- Consumer electronics
- Format : Paste/Printable
- Bond-Line Thickness (BLT) : 0.038
- Thermal Conductivity : 8.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance : 0.04-0.08 at no shim °C cm²/w, Test Method ASTM D5470 Modified
- Specific Gravity : 2.5 g/cm3, Test Method ASTM D374
- Drying Type : Fast
- Viscosity : 177
- Sub-segment : Notebook/Tablet/PC
- Application : CPU|GPU
- Vertical : Consumer Electronics
- Industry : Consumer electronics
Application Note
Name
Description
File Size
Date
Size
In Modern Electronic Devices
application/pdf 313.51 KB
6/12/2025
313.51 KB
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
application/pdf 898.07 KB
6/12/2025
898.07 KB
Case Study
Name
Description
File Size
Date
Size
For New Energy Vehicle Inverters
application/pdf 3.31 MB
6/12/2025
3.31 MB
Name
Description
File Size
Date
Size
In Modern Electronic Devices
application/pdf 313.51 KB
6/12/2025
313.51 KB
For New Energy Vehicle Inverters
application/pdf 3.31 MB
6/12/2025
3.31 MB
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
application/pdf 898.07 KB
6/12/2025
898.07 KB
Name
Description
File Size
Date
Size
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
898.07 KB
6/12/2025
For New Energy Vehicle Inverters
3.31 MB
6/12/2025