Phase Change Materials
PTM6000
PTM6000 is a Phase Change Pad with a Thermal Impedance of 0.06 - 0.08 (OC cm²/w), Thermal Conductivity of 4.4 (w/mk) and Specific Gravity of 2.3 (g/cm³)
Please sign in to access more documents
Once signed in, you may be able to access additional documents for your account.
Overview
PTM6000 is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing required for long product life applications. Like all phase change materials, it has stable thermal impedance across accelerated aging tests and does not display bleeding, pumping, or flow out. It can withstand temperatures up to 150°C.
PTM6000 has a Thermal conductivity of 4.4 (W/m·K) depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The proprietary material provides superior reliability and maintains low thermal impedance (0.06-0.08), making it desirable for high-performance integrated circuit devices.
PTM6000 has a Thermal conductivity of 4.4 (W/m·K) depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The proprietary material provides superior reliability and maintains low thermal impedance (0.06-0.08), making it desirable for high-performance integrated circuit devices.
Specifications
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Color
- Grey
- Shelf Life
- 12 months Year
- Specific Gravity
- 2.3 g/cm3, Test Method ASTM D374
- Thickness (mm)
- 0.2 / 0.25 / 0.3 / 0.4 / 0.5
- Viscosity
- N/A
- Liner Color
- Yellow
- Format
- Pad
Thermal Properties
- Thermal Conductivity
- 4.4 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.06-0.08 at no shim °C cm²/w, Test Method ASTM D5470 Modified
Electrical Properties
- Volume Resistivity
- 2.1x1014 ohm-cm, Test Method ASTM D259
General Information
- Application
- CPU
- GPU
- Key Features
- High Reliability
- Typical Uses
- IGBT
- Lighting
- Power control unit, inverter, onboard electronics
- Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)
- Switches, routers, base stations
- Tablets, gaming, notebooks, smartphones, action cameras
- Vertical
- Telecom/Data Center
- Sub-segment
- AI/HPC
- Industry
- Telecom/Data Center
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Color
- Grey
- Shelf Life
- 12 months Year
- Specific Gravity
- 2.3 g/cm3, Test Method ASTM D374
- Thickness (mm)
- 0.2 / 0.25 / 0.3 / 0.4 / 0.5
- Viscosity
- N/A
- Liner Color
- Yellow
- Format
- Pad
Thermal Properties
- Thermal Conductivity
- 4.4 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.06-0.08 at no shim °C cm²/w, Test Method ASTM D5470 Modified
Electrical Properties
- Volume Resistivity
- 2.1x1014 ohm-cm, Test Method ASTM D259
General Information
- Application
- CPU
- GPU
- Key Features
- High Reliability
- Typical Uses
- IGBT
- Lighting
- Power control unit, inverter, onboard electronics
- Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)
- Switches, routers, base stations
- Tablets, gaming, notebooks, smartphones, action cameras
- Vertical
- Telecom/Data Center
- Sub-segment
- AI/HPC
- Industry
- Telecom/Data Center
- Viscosity : N/A
- Thickness (mm) : 0.2 / 0.25 / 0.3 / 0.4 / 0.5
- Thermal Impedance : 0.06-0.08 at no shim °C cm²/w, Test Method ASTM D5470 Modified
- Thermal Conductivity : 4.4 W/m-K, Test Method ASTM D5470
- Specific Gravity : 2.3 g/cm3, Test Method ASTM D374
- Shelf Life : 12 months Year
- Liner Color : Yellow
- Format : Pad
- Color : Grey
- Bond-Line Thickness (BLT) : 0.038
- Volume Resistivity : 2.1x1014 ohm-cm, Test Method ASTM D259
- Application : CPU|GPU
- Vertical : Telecom/Data Center
- Typical Uses : IGBT|Lighting|Power control unit, inverter, onboard electronics|Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)|Switches, routers, base stations|Tablets, gaming, notebooks, smartphones, action cameras
- Sub-segment : AI/HPC
- Key Features : High Reliability
- Industry : Telecom/Data Center
Application Note
Name
Description
File Size
Date
Size
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
application/pdf 898.07 KB
6/12/2025
898.07 KB
In Modern Electronic Devices
application/pdf 313.51 KB
6/12/2025
313.51 KB
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Case Study
Name
Description
File Size
Date
Size
For New Energy Vehicle Inverters
application/pdf 3.31 MB
6/12/2025
3.31 MB
Name
Description
File Size
Date
Size
For New Energy Vehicle Inverters
application/pdf 3.31 MB
6/12/2025
3.31 MB
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
application/pdf 898.07 KB
6/12/2025
898.07 KB
In Modern Electronic Devices
application/pdf 313.51 KB
6/12/2025
313.51 KB
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Name
Description
File Size
Date
Size
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
898.07 KB
6/12/2025
Thermal Interface Materials Electronics Brochure
820.98 KB
10/31/2023
For New Energy Vehicle Inverters
3.31 MB
6/12/2025
