PTM7000-SP

PTM7000-SP is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing, which is required for long product life applications. Like all phase change materials, it has stable thermal impedance across accelerated aging tests and does not display bleeding, pumping, or flow out.

PTM7000-SP has a thermal conductivity of 6.5 (W/m·K), depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The usual temperature range is -40°C to 125°C. This proprietary material provides superior reliability and maintains low thermal impedance (0.04 – 0.07), making it desirable for high-performance integrated circuit devices. Regarding breakdown voltage, phase change materials are typically around 5000V/mm, which is highly thickness-dependent.  An initial "unphased" 0.2mm pad will have a different BV than the final 30/40um bondline.