Phase Change Materials
PTM7950
PTM7950 is a Phase Change Pad with a Thermal Impedance of 0.04 - 0.08 (°C cm²/w), Thermal Conductivity of 8.5 (w/mk) and Specific Gravity of 2.8 (g/cm³)
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Overview
Ready to evaluate PTM7950 for your application?Connect with our team to learn more and evaluate Solstice’s PTM7950, which is a highly thermally conductive Phase Change Material (PCM), engineered for: This proprietary material provides superior reliability (pass 150˚C baking 1000 hours, T/C-B 1000 cycles) and maintains low thermal impedance (<0.04˚Ccm2/W @ no shim), making the PTM7950 series desirable for high performance integrated circuit devices.We invite you to evaluate PTM7950 for your applications, including:Achieving thin bondline and great thermal performance by minimum pressure applicationOne of the key characteristics of PTM7950 is its bondline thickness, which refers to the thickness of the layer of adhesive between two surfaces being bonded. Please refer to the chart-PTM7950 Bondline Thickness vs. Pressure in the thumbnail to learn more about changes in PTM7950 BLT (mm) under varying pressure conditions (psi).As the pressure applied to PTM7950 increases, the bondline thickness decreases. Specifically, a minimum pressure of 10 psi is needed to observe a significant reduction in bondline thickness. This means that lower pressure is sufficient to achieve a thinner bondline, which can be advantageous in certain applications.PTM7950 is best-in-class against other thermal materialsRefer to chart-Solstice PTM7950: Comparison of thermal performance (click on the thumbnails to enlarge), where thermal impedance values for various materials is shown, including that of PTM7950 and PTM7900. Both of these materials have the lowest thermal impedance values when compared to all other materials tested, including competitive thermal greases. Overall, the PTM 7950 is the top performer among all materials tested for thermal impedance. The PTM 7950 is clearly the best choice for thermal impedance, with the lowest value among all materials tested. This makes it an excellent option for electronic devices that require exceptional thermal management.Get in touch with our experts to learn more.
- Minimizing thermal resistance at interfaces
- Maintaining excellent performance
- Providing scalable application at a competitive cost
- Power modules/inverters in automotive and power applications
- High-performance IT/enterprise computing devices
- Consumer electronics, high-performance IC
- High power LED
- PTM7950 Pad | Easy application and no drying steps
- PTM7950-SPS | Paste version with slow-drying solvent
- PTM7950-SP | Paste version for automatic stencil printing
- High performance filler and polymer technology
- Silicone-free, no pump out, bleed out, dry out issues
- Highly conductive filler loading to optimize performance
- Industry-proven superior long-term reliability
- Min BLT~20um, typical BLT is below 50um
- 30~40 psi pressure is needed for usage
Specifications
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Color
- Grey
- Shelf Life
- 12 months Year
- Specific Gravity
- 2.8 g/cm3, Test Method ASTM D374
- Thickness (mm)
- 0.2
- 0.25
- 0.3
- 0.4
- 0.5
- Viscosity
- N/A
- Liner Color
- Light
- Format
- Pad
Thermal Properties
- Thermal Conductivity
- 8.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.04-0.08 at no shim °C cm²/w, Test Method ASTM D5470 Modified
General Information
- Application
- Base Station
- CPU
- GPU
- Optical
- Switch
- Thin Bondline
- Transceiver
- Key Features
- High Reliability
- Low TI
- Sub-segment
- Networks
- Notebook
- PC
- Tablet
- Industry
- Consumer Electronics
- Technology and Telecommunications
Other
- Other Notes
- Pads available in sheets and rolls
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Color
- Grey
- Shelf Life
- 12 months Year
- Specific Gravity
- 2.8 g/cm3, Test Method ASTM D374
- Thickness (mm)
- 0.2
- 0.25
- 0.3
- 0.4
- 0.5
- Viscosity
- N/A
- Liner Color
- Light
- Format
- Pad
Thermal Properties
- Thermal Conductivity
- 8.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.04-0.08 at no shim °C cm²/w, Test Method ASTM D5470 Modified
General Information
- Application
- Base Station
- CPU
- GPU
- Optical
- Switch
- Thin Bondline
- Transceiver
- Key Features
- High Reliability
- Low TI
- Sub-segment
- Networks
- Notebook
- PC
- Tablet
- Industry
- Consumer Electronics
- Technology and Telecommunications
Other
- Other Notes
- Pads available in sheets and rolls
- Color : Grey
- Bond-Line Thickness (BLT) : 0.038
- Thermal Conductivity : 8.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance : 0.04-0.08 at no shim °C cm²/w, Test Method ASTM D5470 Modified
- Specific Gravity : 2.8 g/cm3, Test Method ASTM D374
- Thickness (mm) : 0.2|0.25|0.3|0.4|0.5
- Liner Color : Light
- Shelf Life : 12 months Year
- Viscosity : N/A
- Format : Pad
- Key Features : High Reliability|Low TI
- Sub-segment : Networks|Notebook|PC|Tablet
- Application : Base Station|CPU|GPU|Optical|Switch|Thin Bondline|Transceiver
- Industry : Consumer Electronics|Technology and Telecommunications
- Other Notes : Pads available in sheets and rolls
Application Note
Name
Description
File Size
Date
Size
In Modern Electronic Devices
application/pdf 316.14 KB
8/7/2025
316.14 KB
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
application/pdf 900.68 KB
8/7/2025
900.68 KB
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
Data Sheet
Name
Description
File Size
Date
Size
Phase Change Materials: LTM6300 - PCM45F -PTM5000
application/pdf 64.53 KB
8/11/2025
64.53 KB
Case Study
Name
Description
File Size
Date
Size
For New Energy Vehicle Inverters
application/pdf 3.31 MB
6/12/2025
3.31 MB
Name
Description
File Size
Date
Size
In Modern Electronic Devices
application/pdf 316.14 KB
8/7/2025
316.14 KB
Phase Change Materials: LTM6300 - PCM45F -PTM5000
application/pdf 64.53 KB
8/11/2025
64.53 KB
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
For New Energy Vehicle Inverters
application/pdf 3.31 MB
6/12/2025
3.31 MB
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
application/pdf 900.68 KB
8/7/2025
900.68 KB
Name
Description
File Size
Date
Size
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
900.68 KB
8/7/2025
Thermal Interface Materials Electronics Brochure
821.77 KB
8/7/2025
Phase Change Materials: LTM6300 - PCM45F -PTM5000
64.53 KB
8/11/2025
For New Energy Vehicle Inverters
3.31 MB
6/12/2025
